Packaging Type Semiconductor devices, Model NameNumber Tresky T-4909AE Semi Automatic Die Bonder, Bonding Accuracy Up to 10 microns

Active
Premium

Key Highlights

Tresky T-4909AE 1 Semiconductor devices
Request Price
MOQ
1

Available Variants

WhatsApp

Technical Specifications

Parameter Value
Packaging Type Semiconductor devices
Size Of Machine Table top
Bonding Accuracy Up to 10 microns
Model Name/Number Tresky T-4909AE
Minimum Order Quantity 1

Product Description

Buy High-Precision Semi Automatic Die Bonder Machines in Gurugram

The t, 5300 really shines in applications with highest such as, Precision requirements flip, Chip or laserdiode placement. The t, 5300, W is equiped with tresky s electronic die ejector system for pick, Up from wafer. An optional high, Resolution beam splitter unit allows sub, Micron placement accuracy. Technical data voltage 110v / 220v spindle rotation 360 unlimited weight 95kg, 30kg option depending max. Pc board, / substrate size 400mm x 280mm optical resolution flip, Chip optic 1x option 1. 25 m optical resolution flip, Chip optic 2x option 0. 625 m dimensions with all in one pc 1155mm x790mm x728mm xy, Movement placement stage 220mm x 220mm manual bond force 20g, 4000g other force ranges available 10g, 10000g z, Movement 120mm automatic with z, Measurement resolution 0. 001mm placement accuracy 10 m,

Shipping Information

Availability
In Stock
Price
Excluding all taxes
Ships from
Gurugram
Delivery Location
All India delivery available
Shipping
As per delivery location

Seller Information

H
Gurugram, Haryana, India
4.7
Rating
98%
Response Rate
Established: 2011
Delivery Time: To be Negotiated
Shipping Options:
Air, Sea, Road
View Company Profile

Trust & Safety

Trade Assurance Protected
Secure Payment Methods
Logistics Tracking Available
24/7 Customer Support