Power mosfets from international rectifier utilize advanced processing techniques to achieve extremely low on, Resistance per silicon area. Combined with, This benefit the fast switching speed and ruggedized device design that hexfet power mosfets are well provides the, Known for designer with an extremely efficient and reliable device for use offered in numerous options of applications. The d2pak is a surface mount power package capable of accommodating die available in dimensions reaching hex, 4. It provides the highest power capability and the lowest possible on, Resistance in any existing surface mount package. The d2pak is appropriate for high current applications due to its low internal connection resistance and can dissipate up to 2. 0w in a typical surface mount application.