Packaging Type Semiconductor devices, Model NameNumber Tresky T-4909AE Semi Automatic Die Bonder, Bonding Accuracy Up to 10 microns
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| Parameter | Value |
|---|---|
| Packaging Type | Semiconductor devices |
| Size Of Machine | Table top |
| Bonding Accuracy | Up to 10 microns |
| Model Name/Number | Tresky T-4909AE |
| Minimum Order Quantity | 1 |
Product Description
Buy High-Precision Semi Automatic Die Bonder Machines in Gurugram
The t, 5300 really shines in applications with highest such as, Precision requirements flip, Chip or laserdiode placement. The t, 5300, W is equiped with tresky s electronic die ejector system for pick, Up from wafer. An optional high, Resolution beam splitter unit allows sub, Micron placement accuracy. Technical data voltage 110v / 220v spindle rotation 360 unlimited weight 95kg, 30kg option depending max. Pc board, / substrate size 400mm x 280mm optical resolution flip, Chip optic 1x option 1. 25 m optical resolution flip, Chip optic 2x option 0. 625 m dimensions with all in one pc 1155mm x790mm x728mm xy, Movement placement stage 220mm x 220mm manual bond force 20g, 4000g other force ranges available 10g, 10000g z, Movement 120mm automatic with z, Measurement resolution 0. 001mm placement accuracy 10 m,
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Seller Information
H
Higgs Boson Systems Private Limited
Verified
Gurugram, Haryana, India
Established:
2011
Delivery Time:
To be Negotiated
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