Introducing the semiautomatic wire bonder, A versatile remedy for each wedge and ball bonding applications. Equipped with three this system, Motorized axes offers precise and efficient wire bonding, Ensuring high, Quality connections in electronic components. The motorized axes provide enhanced control and accuracy, Allowing to ensure reliable operation and repeatability. Designed to ensure convenience in use, The user, Friendly interface simplifies the An excellent, Bonding process choice for for both small, Scale and production environments. Regardless of your requirements reliable wedge bonding or precise our semiautomatic, Ball bonding wire bonder delivers boosting productivity, Exceptional results and excellence in your wire bonding operations. Technical data wb, 300, U bond methods wedge, Ball, Bump and secure ball bonding gold wire diameter 17, 50 m aluminium wire diameter 17, 50 m ultraonic system pll control 62 khz transducer ultrasonic power 0, 2 watt bond time 5, 5000 msec. Bond force 5, 100 cn transducer modell wbt140 wedge and ball transducer frequency 62 khz total length 185 mm horn length 140 mm collar length 23 mm bond tool 1, 58 dm. 19 mm length 0, 0626 x 0, 750 axes motorized z, Axis 40 mm motorized y, Axis 50 mm motorized x, Axis 50 mm mouse ration programmable motorized wire spool modell mw 50, 8 mm, 2 wire termination bond head tear / clamp tear wire feed angle 90 clamp movemente motorized, Up and down wire strength 12, 50 m 2 wire spool wire control by infrared sensor and micro controller heated chuck model hp, 60 heated area 60 mm diameter temperature max. 250 c temp. Accuracy 1 % height adjustable 66, 78 mm electrical requirements wb, 300, U voltage 100 240V supply, Fifty, Sixty hz current max. 5 a dimension 580 x 510 x 490 mm weight 45 kg