PCB Inspection System VT-S730

Last update september 24, 2014improvement cycle for high, Quality product manufacturingthe efficient improvement cycle ensuring the output of high, Quality products promotes the minimization of quality costs . This can further intensify the environment for quality improvement initiatives. Process control quality management system q, Up navi quality control during the pcb production process and efforts in process improvement with the post, Reflow quality as the starting point are possible. V, Db compatibility with the x700 is currently under development. Technologies supporting 3d, Sji patent pending omron s unique technology color highlight 3d shape reconstruction uses an optimal principle enabling a stable inspection of the reflection surface like a solder joint. Auto generation of inspection programs the vertical startup of inspection programs is possible due to the combination of the color highlight tm 3d shape reconstruction and phase, Shift principle. Requires post, Reflow pcb and mount data. Quantitative inspection solder and component shapes can be measured stable inspection reduces the secondary reflection and shadow interference light reflection on adjacent components or solders oblique viewing camera incorporated enables detecting solders under which is, The components physically undetectable from direct view land position recognition and correction are performed for each individual image screen, Enabling the detection of warped or expanded/contracted pcbs