Material Melting Temperature 63 SN37PB, UsageApplication For Industrial Use Solder 6337, Purity 99, Brand ALPHA

Alpha om, 6106 ultra, Fine pitch solder paste description alpha om, 6106, Is a cleaning-free solder, Low residue paste designed to maximize smt line throughput and yields. The flux vehicle is rheologically formulated to deliver outstanding ultra, Fine pitch and highspeed printing properties. The alpha om, 6106 activation the system is designed to be optimized to enhance joint solderability, Solderballs and other soldering defects while maintaining long term reliability. Key attributes and advantages alpha om, 6106 works well for ultra, Fine pitch programs like 0. 5mm 20 mil pitch flip, Chip and 0201 assembly. Excellent print repeatability to 0. 25mm 10 mil circles at high print speeds based upon a 0. 125mm 5 mil stencil thickness . Excellent response to generating less, Pause performance defects due to start up. Uses universally available type 3 powder. High up to, Print speed 200mm/sec 8/sec and fast release speed to give rapid print cycle times. Low residue level with minimal spread for reliable underfilling processes and results. Excellent solderballing characteristics. Outstanding trustworthiness attributes halide, Free material. Alloy specifications and details 62sn/36pb/2ag and 63sn/37pb size classification of powder 3, 25, 45 mm in compliance with ipc j, Std, 005 standards offered in jars weighing 500 grams 6 and Twelve cartridges included, Dek proflow cassettes. Flux gel Comes in 10cc and 30cc syringes for refurbishment needs applications. Safety created for use with both regular and fine pitch smt stencil printing with apertures 0, 25mm 10 mil diameter and print speeds up to 200mm/sec 8/sec with standard width of the stencil material 0. 100mm 4 mil thickness to 0. 150mm 6 mil, Notably when used together with alpha stencils. Consult the sds for all safety information. The most recent version of the sds is available from alpha technical data category results procedures/remarks chemical properties activity level rel, 0 = j, Std classification corrosivity cu mirror pass l ipc j, Std, 004 halide content halide free by titration . Passes ag chromate test ipc j, Std, 004 bono testing pass corrosion and residue bono testing standard electrical properties sir ipc 7 days @ 85 c/85% rh 2. 6 x 109 ipc j, Ohms pass, Std, 004 {pass = 1 x 108 ohm min, Uncleaned} sir bellcore 96 hours @35 c/85% rh 1. 9 x 1012 ohms pass, Bellcore gr78, Core {pass = 1 x 1011 ohm min} electromigration bellcore 500 hours @65 c/85 rh initial 1. 4 x 109 ohms, Final 9. 3 x 109 ohms pass, Bellcore gr78, Core 62sn/36pb/2ag {pass= final > initial/10} physical properties colourless flux, Color clear residue tack force less than 1 g/mm2 change at 25%, 50% and 75% rh ipc j, Std, 005 viscosity 89. 5% metal load designated m14 for printing applications. Malcom spiral viscometer, J, Std, 005 coalescence test able to reflow at 170 m circle size in nitrogen process internal coalescence test solder ball pass < 10 count 62sn/36pb/2ag and 63sn/72 hour pass ipc, 1 hour pass, 37pb alloy class 2 j, Std, 005b tm, 650 2. 4. 43 din standard 32 513, 4. 4 processing guidelines storage & handling1. Refrigerate to guarantee stability @ 0, 10 c 32, 50 f 2. Period of effectiveness refrigerated paste is six months. 3. Paste can be stored for 4 weeks at room heat levels reaching as high as 25 c 77 f . 4. When refrigerated, Warm, Up of paste container to room temperature for up to 8 hours. Paste must be 18 c 64 f before processing. Verify paste temperature is above 18 c 64 f or greater before setup. Printing can be performed at temperatures up to 28 c 81 f . 5. Do not remove worked paste from stencil and mix with unused paste in jar. This will alter rheology of unused paste. 6. These are starting recommendations and all process settings should be reviewed independently