Physical State Solid Solder Paste Lead Free, UsageApplication For Industrial Use, Brand ALFA

T e c h n i c a l b u l l e t i n sm895, 15 alpha om, 340, No, Clean, Lead, Free solder paste fine feature, Zero halogen1, Low head in pillow defect, Highly pin testable description alpha om, 340 is a lead, Free, Solder paste that requires no cleaning designed for a diverse selection of applications. Alpha om, 340 provides best in class low defect rate for head in pillow defects combined with excellent first pass yield on ict/pin testing. Alpha om, 340 also yields excellent print capability performance across various board designs and, Particularly, With ultra fine feature repeatability and high through, Put applications. Outstanding reflow process window delivers superior soldering on cuosp with excellent coalescence on a broad range of excellent random, Deposit sizes solder ball resistance and mid, Chip solder ball performance. Alpha om, 340 has been crafted to deliver excellent visual joint cosmetics and best in class in circuit pin test yields. Additionally, Alpha om, 340 s capability of ipc class iii for voiding and rol0 ipc classifications ensures maximum long, Term product reliability. 1 zero halogen is defined as no halogen is intentionally included in the formulation Advantages and highlights maximizes reflow yield for lead, Free processing, Allowing full alloy coalescence at circular dimensions as small as 200 m 8 mil with 100 m 4 mil thick stencils excellent print consistency with high process capability index across all board designs. Print speeds with a limit of 150mm/sec 6 /sec, Enabling a fast print cycle time and a high throughput. Wide reflow profile window with good solderability on various board / component finishes. Excellent solder and flux cosmetics after reflow soldering best in class low defect rate for head in pillow best in class in circuit pin test yield reduction in random solderballing levels, Minimizing rework and increasing first time yield meets highest ipc 7095 voiding performance classification of class iii superior dependability features halide, Free material compatible with either nitrogen or air reflow zero halogen no halogen intentionally added to the formulation details on alloy compositions sac305 96. 5%sn/3. 0%ag/0. 5%cu sac405 95. 5%sn/4. 0%ag/0. 5%cu sacx plus 0307 99%sn/0. 3%ag/0. 7%cu sacx plus 0807 98. 5%sn/0. 8%ag/0. 7%cu innolot 90. 95%sn/3. 8%ag/0. 7%cu/1. 4%sb/0. 15%ni/3%bi for other alloys, Please contact your local cookson electronics sales office. Type of powder granularity 3 25, 45 m according to ipc j, Std, 005 specifications type 4 20, 38 m per ipc j, Std, 005 type 5 15, 25 m per ipc j, Std, 005 residues approximately 5% by w/w available in 500-gram jar sizes 6 & A and 10cc and 30cc, Set of 12 cartridges, Dek proflow cassettes dispense syringes flux gel om, 340 flux gel is Offered in 10cc and 30cc syringe sizes for reprocessing applications. Lead free complies with rohs directive 2002/95/ec. Application designed to cater to both typical and fine pitch stencil printing, At print speeds of between 25mm/sec 1 /sec and 150mm/sec 6 /sec, With thickness of the stencil 100 m 4 thousandths to 150 m 6 mil, Especially in cases where used with alpha stencils. Blade pressures should be 0. 18, 0. 27 kg/cm of blade 1. 0, 1. 5 ibs/inch, Grounded in the print speed. The higher the print speed employed, The higher the blade pressure that is required. The reflow process window will give high soldering yield with good cosmetics and minimized rework. Halogen status alpha om, 340 is a zero halogen product and passes the standards listed in the table below halogen standards standard requirement test method status jeita et, 7304 definition of halogen free soldering materials < 1000 ppm br, Cl, F in solder material solids pass iec 612249, 2, 21 post soldering residues contain < 900 ppm each or total of < 1500 ppm br