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Higgs Boson Systems Private Limited
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- Air Flow Resistance Test Machine Service, Service Duration 2 Days
- FR- -powered, film characterization tool at the Point-of-Need, Material Strong and Long Lasting
- Manual Universal Flip Chip Die Bonder, Material Paper
- Radiographic Film Viewer Machine, UsageApplication Industrial X ray Viwer
- Semi Automatic Die Bonder, Packaging Type Semiconductor devices
- Semiautomatic Wire Bonder wegde ball with 3 motorized axes, Heat tank width 6-101215
Air Flow Resistance Test Machine Service, Service Duration 2 Days
FR- -powered, film characterization tool at the Point-of-Need, Material Strong and Long Lasting
Manual Universal Flip Chip Die Bonder, Material Paper
Radiographic Film Viewer Machine, UsageApplication Industrial X ray Viwer
Semi Automatic Die Bonder, Packaging Type Semiconductor devices
Semiautomatic Wire Bonder wegde ball with 3 motorized axes, Heat tank width 6-101215
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C2-2694, Sushant Lok-1, Gurugram, Haryana, 122002, India
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Monday - Friday: 8:00 AM - 6:00 PM
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